Monitoring of laminate cure with microdielectrometry
- 1 March 1986
- journal article
- research article
- Published by Wiley in Polymer Engineering & Science
- Vol. 26 (5) , 358-361
- https://doi.org/10.1002/pen.760260506
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- In-situMeasurement of the Properties of Curing Systems with MicrodielectrometryThe Journal of Adhesion, 1982
- MicrodielectrometrySensors and Actuators, 1981
- Electrical properties of an epoxy resin during and after curingJournal of Polymer Science Part A-1: Polymer Chemistry, 1972
- Electrical properties of epoxy resins during polymerizationJournal of Applied Polymer Science, 1959