Application of polyimide resin to semiconductor devices in Japan
- 1 March 1988
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electrical Insulation Magazine
- Vol. 4 (2) , 15-23
- https://doi.org/10.1109/57.822
Abstract
Polyimide resins that have been developed and marketed for semiconductor applications by Japanese companies are reviewed. Test results for devices in which polyimide resins are used as the interlayer insulator, alpha-ray shielding, or buffer coating film are presented. The status of the development of new polyimides for semiconductors is discussed.Keywords
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