Failure Modes of Beam-Lead Semiconductors in Thin-Film Hybrid Microcircuits

• 1 December 1976
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
• Vol. 12  (4) , 298-304
• https://doi.org/10.1109/tphp.1976.1135160

Abstract

Keywords

• SILICON
• PRODUCTION
• METALLIZATION
• SEMICONDUCTOR DEVICES
• THIN FILM
• FAILURE MODE
• HYBRID SYSTEM