Reliability Studies of Polysilicon Fusible Link PROM's
- 1 April 1976
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 07350791,p. 193-197
- https://doi.org/10.1109/irps.1976.362741
Abstract
Reliability aspects of polycrystalline silicon fusible link PROM's have been investigated and discussed in terms of manufacturing and accelerated lifetesting. lifetest data indicate that the "grow back" failure made operative in nichrome fuse PROM's is not present in polysilicon fuses. Failure rates associated with the fuse structure are considerably below the inherent failure rate of the bipolar device.Keywords
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