Variables affecting the wetting of tinplate by Sn-Pb solders
- 1 December 1971
- journal article
- physical chemistry
- Published by Springer Nature in Metallurgical Transactions
- Vol. 2 (1) , 103-111
- https://doi.org/10.1007/bf02662643
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
- Relation of the Equilibrium Contact Angle to Liquid and Solid ConstitutionPublished by American Chemical Society (ACS) ,1964
- The influence of fluxes on the spreading power of tin solders on copperTransactions of the Faraday Society, 1938
- Surface Tension of Metals with Reference to Soldering ConditionsIndustrial & Engineering Chemistry, 1927
- FILMS. THE SPREADING OF LIQUIDS AND THE SPREADING COEFFICIENTJournal of the American Chemical Society, 1922
- The Dynamics of Capillary FlowPhysical Review B, 1921
- Ueber die Abhängigkeit der Capillaritäts‐Constanten des Alkohols von Substanz und Gestalt des benetzten festen KörpersAnnalen der Physik, 1863