Interface Reaction and Mechanical Properties of Lead-free Sn-Zn Alloy/Cu Joints
- 1 January 2002
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 43 (8) , 1797-1801
- https://doi.org/10.2320/matertrans.43.1797
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
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- Wetting and interface microstructure between Sn–Zn binary alloys and CuJournal of Materials Research, 1998
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- Interstitial Diffusion of Copper in TinJournal of Applied Physics, 1967