Heat Exchange Optimization Technique for High-Power Hybrid IC's

• 1 June 1979
• journal article
• Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
• Vol. 2  (2) , 226-231
• https://doi.org/10.1109/tchmt.1979.1135455

Abstract

Keywords

• THICK-FILM CIRCUIT THERMAL FACTORS