Application and analysis of thermosensitive parameters in the case of hybrid power modules
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Simulation of hybrid power components: a new electrothermal modelPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Transient thermal response of power semiconductors to short power pulsesIEEE Transactions on Power Electronics, 1993
- Evaluation of modern power semiconductor devices and future trends of convertersIEEE Transactions on Industry Applications, 1992
- An inverse method to determine the temperature profile on a semiconductor power diodeIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1988
- Thermal characterization of power transistorsIEEE Transactions on Electron Devices, 1976