An analytical comparison of the thermal performance of various ball grid array packaging technologies
- 1 March 2000
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 40 (3) , 485-495
- https://doi.org/10.1016/s0026-2714(99)00210-3
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Microelectronics Packaging HandbookPublished by Springer Nature ,1997