Study of a new structured leadframe based CSP, Mini-LOC
- 7 November 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 364-369
- https://doi.org/10.1109/ectc.2000.853178
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Palladium as a lead finish for surface mount integrated circuit packagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- Solder Joint ReliabilityPublished by Springer Nature ,1991