Quantitative DTA of epoxy adhesives of technological interest
- 1 August 1981
- journal article
- Published by Springer Nature in Journal of Thermal Analysis and Calorimetry
- Vol. 21 (2) , 299-307
- https://doi.org/10.1007/bf01914214
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
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- Chemo‐rheology of curing in structural adhesives I: Epoxy‐phenolic systemsJournal of Polymer Science Part C: Polymer Symposia, 1971
- Morphology and mechanical behavior of block polymersJournal of Polymer Science Part C: Polymer Symposia, 1969
- Differential scanning calorimetry of epoxy resinsPolymer, 1968
- Technique for simultaneous thermogravimetric, derivative thermogravimetric, differential thermal, and electrothermal analysesAnalytical Chemistry, 1967