Epoxy resins possessing flame retardant elements from silicon incorporated epoxy compounds cured with phosphorus or nitrogen containing curing agents
Top Cited Papers
- 1 July 2002
- Vol. 43 (15) , 4277-4284
- https://doi.org/10.1016/s0032-3861(02)00234-3
Abstract
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This publication has 33 references indexed in Scilit:
- Flame retardant epoxy polymers using phosphorus‐containing polyalkylene amines as curing agentsJournal of Applied Polymer Science, 2001
- Thermal Stability of Imidized Epoxy Blends Initiated by N-Benzylpyrazinium Hexafluoroantimonate SaltMacromolecules, 2001
- Characterization and properties of new silicone-containing epoxy resinPolymer, 2000
- A flame-retardant phosphate and cyclotriphosphazene-containing epoxy resin: Synthesis and propertiesJournal of Polymer Science Part A: Polymer Chemistry, 2000
- Properties and curing kinetic of diglycidyl ether of bisphenol A cured with a phosphorus-containing diamineJournal of Applied Polymer Science, 1999
- Synthesis and characterization of epoxy film cured with reactive polyimidePolymer, 1999
- Synthesis, characterization, thermal and flame-retardant properties of silicon-based epoxy resinsJournal of Applied Polymer Science, 1999
- Properties of Epon 828 resin cured by cyclic phosphine oxide tetra acidJournal of Applied Polymer Science, 1998
- An interpenetrated system based on a tetrafunctional epoxy resin and a thermosetting bismaleimide: Structure-properties correlationJournal of Applied Polymer Science, 1998
- Curing characteristics ofo-cresol novolac epoxy resin modified by bismaleimideJournal of Polymer Science Part A: Polymer Chemistry, 1996