An investigation of conductive polymer flip chip attachment in multichip module applications
- 19 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Electrical, structural and processing properties of electrically conductive adhesivesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Electrical conductivity of short carbon fiber‐reinforced polychloroprene rubber and mechanism of conductionPolymer Engineering & Science, 1992
- Influence of Particle Size on the Electrical Resistivity of Compacted Mixtures of Polymeric and Metallic PowdersJournal of Applied Physics, 1971