Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics
- 1 January 1997
- journal article
- Published by Springer Nature in Journal of Materials Science: Materials in Electronics
- Vol. 8 (6) , 377-383
- https://doi.org/10.1023/a:1018599609177
Abstract
No abstract availableKeywords
This publication has 0 references indexed in Scilit: