The local nominal composition-useful concept for microjoining and interconnection applications
- 1 November 1997
- journal article
- Published by Elsevier in Scripta Materialia
- Vol. 37 (10) , 1575-1581
- https://doi.org/10.1016/s1359-6462(97)00290-x
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Diffusion in a Ternary System Exhibiting a Miscibility GapDefect and Diffusion Forum, 1997
- Modeling joining materials for microelectronics packagingIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1995
- The effect of aging on microstructure, room temperature deformation, and fracture of Sn-Bi/Cu solder jointsJournal of Electronic Materials, 1994