The Design and Evaluation of GaAs Power MESFETs

Abstract
Two power MESFET device structures capable of providing in excess of 1 Watt RF output power in S-band have been fabricated using established small signal MESFET technology. Power added efficiencies of 30%, gains > 8 dB and 1 dB compression powers greater than 1 Watt have been measured. The fabrication and characteristics of these devices will be described and experimental results presented. A beam lead package which makes thermal contact with the top and bottom faces of the MESFET chip will be described as will a technique for the surface thermal profiling of chips using nematic liquid crystals.

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