Residual Stress in the Interfacial Bond Zone of Curing Adhesives by a Sensitive Strain Measurement Technique
- 1 May 1984
- journal article
- Published by Taylor & Francis in The Journal of Adhesion
- Vol. 17 (1) , 21-32
- https://doi.org/10.1080/00218468408078427
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Shear modulus gradients in adhesive interfaces as determined by means of ultrasonic Rayleigh wavesJournal of Applied Physics, 1982
- Impact strength of polymers. 3: The effect of annealing on cold worked polycarbonatesPolymer Engineering & Science, 1981
- The influence of residual stresses and orientation on the properties of amorphous polymersPolymer Engineering & Science, 1980
- Residual stresses in polymers and their effect on mechanical behaviorPolymer Engineering & Science, 1976