The influence of microstructure on stress state of sputter deposited chromium nitride films

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Abstract
Chromium nitride films were deposited on glass and vitreous carbon substrates using reactive direct current (dc) planar magnetron sputtering. Single-phase CrN films had homogeneous microstructures composed of columnar grains with a moderate defect density of uniform arrangement and compressive stresses up to (−) 14 GPa. The dual phase CrN+Cr2N films had asymmetric grains, lower structural homogeneity, a high defect density of random arrangement, and a stress range from tensile (+) 2.15 GPa to compressive (−) 1.14 GPa. Intercrystalline and intracrystalline defects contributed to the stresses observed in the films. Generally, the synergistic effects of deposition conditions promoting high normalized energies (energetic particle bombardment of the film) produced microstructurally uniform, hard coatings which were highly stressed (compressive) with low resistivities.

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