Facing targets type of sputtering method for deposition of magnetic metal films at low temperature and high rate
- 1 September 1980
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Magnetics
- Vol. 16 (5) , 646-648
- https://doi.org/10.1109/tmag.1980.1060683
Abstract
A new type of cathode sputtering apparatus with two targets facing each other has been developed to prepare magnetic films at a high deposition rate without the extreme rise of the substrate temperature. When two disks of iron and nickel were used as targets, the maximum deposition rates obtained were approximately 4000 and 5000 &/min, respectively. The substrate temperature was not elevated above 200&C during sputtering. The high rate deposition of Mo permalloy films also was attempted by co-sputtering of two facing targets composed of disks of iron and nickel and chips of molybdenum. The Vicker's hardness of the obtained Mo permalloy films was about 900 and the typical values of permeability at 1 MHz magnetic field and coercive force at dc magnetic field of them were about 2500 and 0.16 Oe, respectively.Keywords
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- The Effect of rf-Power Dissipation on the Temperature of Substrate in a rf-Sputtering SystemSHINKU, 1973
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