The Microelectronic Wire Bond Pull Test-How to use It, How to Abuse It
- 1 September 1978
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 1 (3) , 203-210
- https://doi.org/10.1109/tchmt.1978.1135290
Abstract
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This publication has 1 reference indexed in Scilit:
- Testing and fabrication of wire-bond electrical connections :Published by National Institute of Standards and Technology (NIST) ,1972