Effects of Stress on the Adhesion of Metals to Polyimides

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Abstract
This paper describes the effects of ambient, thermal and mechanical stress on the adhesion of titanium (Ti) to polyimide (PI). Pull testing on the Ti/PI system shows that metal/polyimide bonding degrades when the composite is thermally cycled. A thermochemical mechanism is proposed that accounts for the interface degradation. We do not treat the adhesive interface as a discrete layer, but rather as a gradual “transition zone” between metal and polymer -- a zone that may grow, and/or change in composition and stress state, thus altering the adhesive properties. The mechanism predicts discontinuities that may develop in the transition zone. Through the use of finite element techniques, it is demonstrated that when loads and displacements are imposed on the composite containing interface discontinuities, large localized stresses develop. Such stresses could explain the experimentally observed low strength failures.

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