Rheology of curing thermosets: A review

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Abstract
Over the past decade great strides have been made in the measurement, modeling and application of the rheology or viscosity history of curing thermosets. This paper will review the work that lead to the formulation of a simple predictive model to simulate the viscosity path of curing epoxies and to the use of the model in the understanding of the epoxy lamination process. Subsequent work by others that has clearly refined, extended, and simplified the method will be discussed.