Reliability characterization of the SLICC package
- 23 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- A comprehensive surface mount reliability model (CSMR) covering several generations of packaging and assembly technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- An internal variable constitutive model for hot working of metalsInternational Journal of Plasticity, 1989