The Incorporation of Sulfur in Electrodeposited Nickel, Using Thiourea as a Brightener and Leveler

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Abstract
The amount of sulfur incorporated into nickel electrodeposited from a Watts plating solution containing thiourea as a brightener and leveler has been investigated by radiotracer techniques and autoradiography. The nickel deposit contains sulfur, and the amount of sulfur increases with decreasing current density when the current density is determined by the external electrical circuit or by the geometry of the plating cell. Autoradiographs taken from oblique sections cut through the nickel deposit show the distribution of the sulfur within the deposit. When the nickel is deposited on a surface having a roughness comparable to that encountered technologically incorporation occurs on the peaks of the surface. Thiourea causes leveling which requires the peaks to be regions of lower current density. Therefore the incorporation of sulfur is higher in regions of lower current density when the current density distribution is determined by the behavior of thiourea on a rough surface. Incorporation probably occurs in layers in regions of the deposit which show a laminar structure.

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