Recent advances in hermetic equivalent flip-chip hybrid IC packaging of microelectronics
- 31 October 1995
- journal article
- Published by Elsevier in Materials Chemistry and Physics
- Vol. 42 (1) , 25-30
- https://doi.org/10.1016/0254-0584(95)80038-7
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Enhancement of flip-chip fatigue life by encapsulationIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991
- The Mechanisms that Provide Corrosion Protection for Silicone Gel Encapsulated ChipsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987