Solderless interconnection and packaging technique for embedded active components
- 20 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 155-159
- https://doi.org/10.1109/ectc.1999.776164
Abstract
No abstract availableThis publication has 1 reference indexed in Scilit:
- Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronicsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002