Prototype packages in aluminium nitride for high performance electronic systems

4 December 2002

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

p. 103-110
https://doi.org/10.1109/ectc.1990.122175

Abstract

The authors illustrate the way in which many standard processing techniques, such as laser cutting, thick- and thin-film deposition, glassing, and soldering, can be used with aluminium nitride and highlight some of the ways in which material and process compatibilities can be achieved. The viability of such techniques is demonstrated by the production of aluminium nitride prototype packages and substrates using thick- and thin-film technologies. It is shown that thick and thin film substrates can be successfully produced in aluminium nitride. These can be incorporated into hermetic demonstrator packages quickly and easily by adopting standard techniques to assemble package components. By adopting this approach, it is possible to achieve a rapid turnaround of small numbers of demonstrator packages, allowing prompt assessment of both chip and package technologies and materials.

Keywords

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