Abstract
The influence of the incident atomic velocity on the structure of evaporated films has been studied for silver films in the thickness range from 50 to 500 Å. The thermal velocities of the evaporated atoms were reduced (i) by "reflection" from a teflon surface at room temperature, and (ii) by "diffusion" through nitrogen gas at 3.0 μ. Films formed by these two methods are compared with "normal" high vacuum films for the same rates of deposition, which were relatively slow (0.4 to 4 Å of thickness per second). The results of both resistivity measurements and electron microscopy show that "diffusion" films are less aggregated, i.e. more continuous, than "normal" high vacuum films. "Reflected" films have a structure intermediate between the other two. A qualitative explanation of the observed effects is given in terms of the formation of nuclei and the growth of aggregates.

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