Evaluation of lead-free eutectic Sn-Ag solder for automotive electronics packaging applications
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Mechanical characteristics of 96.5 Sn/3.5 Ag solder in micro-bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Application of lead-free eutectic Sn-Ag solder in no-clean thick film electronic modulesIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1994
- Solder Paste in Electronics PackagingPublished by Springer Nature ,1992