Verification of FEM analysis of load-deflection methods for measuring mechanical properties of thin films
- 1 January 1990
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
It is shown that in contrast to the analytical models, which have to assume a shape function, the finite-element method (FEM) model yields the shape function, and this shape function is in good agreement with experiment. Through an extensive FEM analysis of load-deflection methods, it is confirmed that while the functional form of the analytical result is correct, three constants in the model must be corrected by as much as 30%. Experimental measurements of the deformed membrane shape have been made, and they match the FEM results, verifying the accuracy of the FEM models. Experimental values extracted from load-deflection analysis for the biaxial modulus and the residual stress of thin films of Dupont PI2525 and Hitachi PIQ13 are presented.Keywords
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