Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance
- 1 March 1999
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 85 (5) , 2583-2590
- https://doi.org/10.1063/1.369624
Abstract
No abstract availableThis publication has 29 references indexed in Scilit:
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