Effect of texture and grain structure on electromigration in Al-0.5%Cu thin films
- 1 January 1981
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 75 (3) , 253-259
- https://doi.org/10.1016/0040-6090(81)90404-1
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
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- Influence of Deposition Parameters on the Coalescence Stage of Growth of Metal FilmsJournal of Applied Physics, 1968