Linewidth dependence of electromigration in evaporated Al-0.5%Cu
- 15 March 1980
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 36 (6) , 464-466
- https://doi.org/10.1063/1.91508
Abstract
The linewidth dependence of electromigration damage has been evaluated for 2.5‐cm‐long, 1–4‐μm‐wide, e‐gun‐evaporated Al‐0.5%Cu conductions. It is observed that the ≲1‐μm lines are much longer lived than the ≳2‐μm lines, reversing the trend at wider widths. These results are rationalized on the basis of the ’’bamboo’’‐type grain structure of narrow lines in contrast to the much more heterogeneous structure of the wider meanders.Keywords
This publication has 2 references indexed in Scilit:
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970
- ELECTROMIGRATION IN SINGLE-CRYSTAL ALUMINUM FILMSApplied Physics Letters, 1970