Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film Conductors
- 1 September 1970
- journal article
- conference paper
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 41 (10) , 3954-3960
- https://doi.org/10.1063/1.1658395
Abstract
Experiments have been undertaken to determine the length and width dependence of electromigration-induced failure time in aluminum thin-film conductors. A statistical model is presented and compared to the experimental data. The significance of the experimental data and the statistical model are discussed in terms of randomly distributed structural defects which produce flux divergences during electromigration.This publication has 4 references indexed in Scilit:
- Electromigration in Thin Al FilmsJournal of Applied Physics, 1969
- RESISTANCE MONITORING AND EFFECTS OF NONADHESION DURING ELECTROMIGRATION IN ALUMINUM FILMSApplied Physics Letters, 1968
- ELECTROMIGRATION EFFECTS IN ALUMINUM FILM ON SILICON SUBSTRATESApplied Physics Letters, 1967
- Current-induced marker motion in gold wiresJournal of Physics and Chemistry of Solids, 1961