Electron‐Microprobe Study of Field‐Assisted Bonding of Glasses to Metals
- 1 May 1973
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 56 (5) , 254-257
- https://doi.org/10.1111/j.1151-2916.1973.tb12482.x
Abstract
Quantitative electron‐microprobe evidence is presented for the specific reactions which occur at electrodes during field‐assisted bonding of glasses to metals. Adherence mechanisms are discussed in relation to conventional glass‐metal sealing techniques. It is concluded that the electric field drives electrochemical reactions which contribute to bond formation by first bringing the surfaces into large‐area contact, as a result of both dielectric forces and electrochemical removal of the high points on the metal, and then maintaining the interfacial bonding structure, established by dissolution of the substrate oxide.Keywords
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