Consequences of the cooling induced by voltage taps at the extremities of electromigration test structures
- 15 February 1992
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 71 (4) , 2015-2017
- https://doi.org/10.1063/1.351141
Abstract
The difference between the rupture localizations observed on two types of electromigration test structures, with or without several width variations, is explained by the effect of the cooling due to voltage taps at the extremities of the structures. The influence of this cooling on the ion flow divergence resulting from the thermal gradient at the extremities of the test structures is studied. Whereas a current density acceleration exponent of 3 is found for temperature-gradient-induced failures at moderated current densities, a value of 1 is predicted for high-current-density accelerated tests.This publication has 3 references indexed in Scilit:
- Thermal analysis of electromigration test structuresIEEE Transactions on Electron Devices, 1987
- Electromigration failure modes in aluminum metallization for semiconductor devicesProceedings of the IEEE, 1969
- Current-induced marker motion in gold wiresJournal of Physics and Chemistry of Solids, 1961