Fatigue life prediction of solder material: effect of ramp time, hold time and temperature
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 505-509
- https://doi.org/10.1109/ectc.1990.122235
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Isothermal fatigue of low tin lead based solderMetallurgical Transactions A, 1988
- Solder Fatigue Problems in Power PackagesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984