Solder Fatigue Problems in Power Packages
- 1 December 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (4) , 405-410
- https://doi.org/10.1109/tchmt.1984.1136381
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Structured Copper: A Pliable High Conductance Material for Bonding to Silicon Power DevicesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Hot Spots Caused by Voids and Cracks in the Chip Mountdown Medium in Power Semiconductor PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic MethodJournal of the Electrochemical Society, 1975