A study on interfacial reactions between electroless Ni-P under bump metallization and 95.5Sn-4.0Ag-0.5Cu alloy
- 1 June 2003
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 32 (6) , 548-557
- https://doi.org/10.1007/s11664-003-0141-z
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallizationJournal of Applied Physics, 2000
- Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion controlJournal of Electronic Materials, 1998