Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control
- 1 November 1998
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 27 (11) , 1167-1176
- https://doi.org/10.1007/s11664-998-0066-7
Abstract
No abstract availableKeywords
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