Solid state intermetallic compound growth between copper and high temperature, tin-rich solders—part I: Experimental analysis
- 1 August 1994
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 23 (8) , 721-727
- https://doi.org/10.1007/bf02651365
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatingsJournal of Electronic Materials, 1994
- Kinetics of interfacial reaction in bimetallic CuSn thin filmsActa Metallurgica, 1982
- A Preliminary Report on Growth of Compound Layers on Various Metal Bases Plated with Tin and its AlloysTransactions of the IMF, 1973