Effect of Interface Roughness on Fatigue Crack Growth in Sn-Pb Solder Joints
- 1 September 1996
- journal article
- Published by ASME International in Journal of Electronic Packaging
- Vol. 118 (3) , 170-173
- https://doi.org/10.1115/1.2792148
Abstract
The effect of interface roughness on fatigue crack growth was studied by examining the contribution of crack-surface sliding to the fatigue crack growth resistance of the interface in 63Sn-37Pb solder joints. Model interfaces with different values of roughness were produced in Sn-Pb/Cu joints by systematically varying the morphology of the intermetallic phase at the interface. Fracture mechanics analysis was conducted to calculate the crack-sliding resistance as a function of interface roughness, contact zone length, the shear strength of the solder, and elastic properties of bi-materials. The results were compared to the variation of fatigue crack growth threshold with interface morphology.Keywords
This publication has 10 references indexed in Scilit:
- Effect of cooling rate on interfacial fatigue-crack growth in Sn-Pb solder jointsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Subcritical crack growth at bimaterial interfaces: Part I. flexural peel techniqueMetallurgical and Materials Transactions A, 1996
- Effect of aging on fatigue crack growth at sn-pb/cu interfacesMetallurgical and Materials Transactions A, 1995
- Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat PackJournal of Electronic Packaging, 1994
- Thermal Fatigue of Low-Temperature Solder Alloys in Insertion Mount AssemblyJournal of Electronic Packaging, 1993
- Elastic Yield Zone Around an Interfacial Crack TipJournal of Applied Mechanics, 1989
- Surface-mount attachment reliability of clip-leaded ceramic chip carriers on FR-4 circuit boardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Elastic Fracture Mechanics Concepts for Interfacial CracksJournal of Applied Mechanics, 1988
- Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power TransistorsIEEE Transactions on Parts, Hybrids, and Packaging, 1977
- Mechanical Properties of Cast Tin-Lead SolderJournal of Testing and Evaluation, 1974