MCM-C/D design for the CMOS implementation of the S/390 system

Abstract
The new Enterprise model for the S/390 system achieves an off chip bus speed of 167 MHz using as a first level package on an alumina based multichip substrate (MCM) with thin film redistribution. A description of the physical attributes of this substrate will be presented in this paper. The electrical considerations used for the design of this MCM are described with emphasis on the techniques used for the noise containment.

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