Experimental results and modeling of noise coupling in a lightly doped substrate
- 24 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 623-626
- https://doi.org/10.1109/iedm.1996.554060
Abstract
While an in-depth experimental study of substrate noise coupling in an epi process has been reported, most research into substrate coupling in lightly doped bulk wafers has been limited to simulations without experimental confirmation. This work presents experimental noise coupling data for a lightly doped substrate, along with corresponding simulation results obtained using a compact model of the substrate. The results of this work provide a general understanding of noise coupling in lightly doped substrates and emphasize the layout dependence of such noise. Without an efficient simulation capability utilizing a compact model of the substrate, it is extremely difficult to predict how noise will couple to a circuit node.Keywords
This publication has 3 references indexed in Scilit:
- LAYIN: toward a global solution for parasitic coupling modeling and visualizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The effects of switching noise on an oversampling A/D converterPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Experimental results and modeling techniques for substrate noise in mixed-signal integrated circuitsIEEE Journal of Solid-State Circuits, 1993