Thermal analysis of multiple-layer structures
- 1 November 1974
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 21 (11) , 674-681
- https://doi.org/10.1109/t-ed.1974.17993
Abstract
The response of temperature to dc and steady-state ac power inputs in multiple-layer rectangular structures has been derived by solving analytically the problem of heat flow in three dimensions. Attention is focused on electrothermal integrated circuit (IC) substrates consisting of a semiconductor, a thermal conductor, and a thermal insulator. The analysis applies as well to single-layer systems, such as conventional IC substrates, for which the transient response of temperature has also been found.Keywords
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