The effect of some composite structures on the thermal resistance of substrates and integrated circuit chips
- 1 March 1973
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Electron Devices
- Vol. 20 (3) , 233-238
- https://doi.org/10.1109/T-ED.1973.17634
Abstract
An exact three-dimensional solution to the differential equation for steady-state heat transfer in composite media has been derived. Detailed results for 0.050-in-square chips mounted on 1- and 2-in-square substrates show that the thermal resistance of alumina substrates may be expected to increase by as much as 80 percent upon application of a glaze to the surface. The thermal resistances of beam lead chips varying in size from 0.050-to 0.150-in square are determined for chip-substrate interface distances from 0.0005 to 0.002 in, both with and without a thermal conducting compound as the interface media.Keywords
This publication has 1 reference indexed in Scilit:
- Thermal impedance of ceramic packages using beam-lead IC chipsProceedings of the IEEE, 1969