Selective and stoichiometric reaction of copper dipivaloylmethanate [Cu(DPM)2] with surface hydroxyls on SiO2
- 9 April 1990
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 56 (15) , 1466-1468
- https://doi.org/10.1063/1.102500
Abstract
Stoichiometric reaction of copper dipivaloylmethanate [Cu(DPM)2] with the hydroxyl group (OH) on SiO2 surface was studied by infrared spectroscopy. The stoichiometric ratio of reacted OH and Cu(DPM)2 was estimated to be ∼2–3:1 from the absorbance of the OH and the CH stretching region. The ligand DPM was removed from the SiO2 surface by treatment with water at 400 °C. The oxidation state of Cu remaining on the surface was proven to be +1 by x‐ray photoelectron spectroscopy.Keywords
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