Texture and phase transformation of sputter-deposited metastable Ta films and multilayers
- 1 April 1996
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 275 (1-2) , 203-206
- https://doi.org/10.1016/0040-6090(95)07043-5
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- On the structure and homogeneity of solid solutions: The limits of conventional X-ray diffractionPhilosophical Magazine A, 1995
- Barriers Against Copper Diffusion into Silicon and Drift Through Silicon DioxideMRS Bulletin, 1994
- Structural studies of multilayered films composed of immiscible pairs Cu and TaJournal of Magnetism and Magnetic Materials, 1993
- Quasiperiodic metallic multilayersJournal of Magnetism and Magnetic Materials, 1993
- Comparison of high vacuum and ultra-high-vacuum tantalum diffusion barrier performance against copper penetrationJournal of Applied Physics, 1993
- The relationship between deposition conditions, the beta to alpha phase transformation, and stress relaxation in tantalum thin filmsJournal of Applied Physics, 1992
- Tantalum as a diffusion barrier between copper and siliconApplied Physics Letters, 1990
- Internal stress minimization in the fabrication of transmissive multilayer x-ray opticsJournal of Vacuum Science & Technology A, 1989
- Structural changes of evaporated tantalum during film growthThin Solid Films, 1982
- A NEW STRUCTURE IN TANTALUM THIN FILMSApplied Physics Letters, 1965