Effect of combination between various polyimide coating materials and molding compounds on the reliability of integrated circuits (ICs)
- 4 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 818-823
- https://doi.org/10.1109/ectc.1990.122284
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- New Photosensitive High Temperature Polymers for Electronic ApplicationsJournal of Macromolecular Science: Part A - Chemistry, 1984