Interface Failure in Lead Free Solder Joints

This publication has 5 references indexed in Scilit:

• Effect of Ni-P Thickness on the Tensile Strength of Cu/Electroless Ni-P/Sn-3.5Ag Solder Joint
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2006
• Influence of Solder Volume on Interfacial Reaction between Sn-Ag-Cu Solder and TiW/Cu/Ni UBM
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2006
• Solder Joint Integrity of Various Surface Finished Build-Up Flip Chip Packages by 4-point Monotonic Bending Test
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2006
• BGA brittle fracture - alternative solder joint integrity test methods
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2005
• The effect of Au plating thickness of BGA substrates on ball shear strength under reliability tests
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003